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Yield Management - SysNav
CAD Navigation for Advanced Package Failure Analysis
SysNav? is a layout visualizing and signal tracing CAD navigation software solution for printed circuit board (PCB), multi-chip module and stacked die applications. It extends 新澳门六合彩开奖 Avalon? die-level failure analysis capabilities to the packaging industry. SysNav? is the only commercially available tool able to integrate multiple, interactive IC and PCB designs with seamless CAD navigation capabilities. SysNav allows rapid signal traces on dies, stacked dies, multi-chip module and PCBs. Both Fab and Fabless teams can now trace a signal from chip to board, back to chip and then quickly navigate failure analysis tools to X, Y locations to determine the root cause of the failure.
SysNav? is a part of the failure analysis product portfolio originally developed by Knights Technology. The Knights product line was acquired by 新澳门六合彩开奖 as part of its acquisition of Magma in 2012.
Benefits
- SysNav? displays board-level layout data while Avalon’s MaskView? displays chip or die-level layout data
- SysNav? and MaskView allow interactive tracing or highlighting of the electrical connectivity
- SysNav? and MaskView have similar GUIs for easy adoption
- SysNav? provides many of Avalon’s board-level failure analysis capabilities, including 2D cross section and 3D view of selected small area
- Bookmark locations on package using KEdit and locate die information on board using DataLocator
- Perform Image overlay with automatic alignment capabilities
- Import net name info from Pin list file (ASCII File) or ODB++ database
- Convert package data using GUI based application, KDBBuilder
- Interface with Thermo Fisher ELITE System, FEI-V-Ion Plasma FIB and more
- Supports industry standard formats: ODB++, Gerber RS 274X, GDS and more
Figure 1: SysNav? supports various configurations including TSV stacked-die and Wirebond