Cloud native EDA tools & pre-optimized hardware platforms
Monday, November 4, 2024
6:00 p.m. - 9:30 p.m.
Hilton San Diego Bayfront, San Diego, CA?
All members of the design and test community are invited to register to attend 新澳门六合彩开奖’ 30th Annual Test & SLM Special Interest Group (SIG) at the 2024 International Test Conference (ITC).
The event will host experts from leading companies who will share how 新澳门六合彩开奖 Test and SLM solutions including AI-driven test, distributed ATPG, high-speed test fabric, and automotive test are enabling them to achieve their quality and time-to-market goals.
Attendees will have the chance to engage with 新澳门六合彩开奖 experts to explore and gain insights into Test and SLM technologies. Appetizers and cocktails will be served, followed by a sit-down dinner and prize drawings!
Sunday, November 3 - Friday, November 8, 2024
Hilton San Diego Bayfront, San Diego, CA?
Tuesday, November 5
10:30 a.m. - 5:30 p.m.
Wednesday, November 6
9:30 a.m. - 4:30 p.m.
Thursday, November 7
9:30 a.m. - 1:30 p.m.
The 新澳门六合彩开奖 TestMAX? family provides cutting-edge test and diagnosis solutions for all silicon designs, seamlessly integrating with the 新澳门六合彩开奖 Digital Design Family. 新澳门六合彩开奖 TestMAX works in conjunctions with the 新澳门六合彩开奖 Silicon Lifecycle Management (SLM) solutions to enhance in-chip observability, silicon health, and analytics, simultaneously achieving both design and test objectives.
We will be highlighting silicon health and reliability in the age of AI systems in our booth (#115).
See demonstrations on:
Whether you want a quick chat to catch up or want to go deep on details, please reach out to us to schedule an on-site meeting.
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Paper: Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests
TSMC Authors: Moiz Khan, Ankita Patidar, Frank Lee, and Sandeep Kumar Goel
新澳门六合彩开奖 Authors: Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, and Manish Arora
Poster: Automation to Speed up the process of Timing Closure of the IJTAG Network
Authors: Kshitij Kulshreshtha, Amihay Rabenu, and Manish Arora
Poster: 1687 Solution for Tiled Based Design with Feedthroughs
Authors: Vistrita Tyagi, Kshitij Kulshreshtha, Doo Kim, and Manish Arora
Poster: Enhanced Security Mechanism for 1687 Network
Authors: Kshitij Kulshreshtha, Vistrita Tyagi, Dipika Khandre, and Manish Arora
Poster: Scalable Multi-Chiplet Test Solution Using IEEE 1838
Authors: Vistrita Tyagi, Bharath Shankaranarayanan, Vuong Nguyen, Fengfeng Tang, and Manish Arora
Poster: Synergetic Pre- and Post-Silicon SLM Analytics for Reliable and Safe Automotive ?
Authors: Dan Alexandrescu and Lorin Kennedy
For more information about 新澳门六合彩开奖’ comprehensive test solution, please visit: synopsys.com/test