The аÄÃÅÁùºÏ²Ê¿ª½± Cloud OpenLink Program enables a multi-vendor environment of EDA, IP and foundry solutions so chip designers can easily access their preferred vendors’ products in the аÄÃÅÁùºÏ²Ê¿ª½± Cloud environment. The аÄÃÅÁùºÏ²Ê¿ª½± Cloud OpenLink application programming interface provides highly secure system-to-system interoperability, allowing chipmakers to easily assemble their design environment on аÄÃÅÁùºÏ²Ê¿ª½± Cloud:
The аÄÃÅÁùºÏ²Ê¿ª½± Cloud OpenLink API provides highly secure system-to-system interoperability with аÄÃÅÁùºÏ²Ê¿ª½± Cloud, allowing chipmakers to easily assemble their design environment on аÄÃÅÁùºÏ²Ê¿ª½± Cloud. Via the API, foundries and EDA and IP vendors can deliver product entitlements and license files directly to the аÄÃÅÁùºÏ²Ê¿ª½± Cloud for use by their customers.
аÄÃÅÁùºÏ²Ê¿ª½± Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New аÄÃÅÁùºÏ²Ê¿ª½± Cloud OpenLink Program
аÄÃÅÁùºÏ²Ê¿ª½± Creates Cloud Program Enabling Cross-Vendor EDA Collaboration